KLA 說明

The defect source identifier displays the data collected from the wafer defect inspection process and the scanning electron microscope process 206 in the defects table 406 of the defect summary screen. All defects are assigned an on-the-fly class from wafer defect inspection process. Selected defects may be analyzed further using an optical microscope and be provided a revisit class. A subset of these defects can be analyzed even further using the scanning electron microscope process 206 and be given a scanning electron microscope-automated defect classification class. Thus, a single defect may be assigned various defect classifications depending upon the metrology tools used to inspect the defect.
At the end of inspection, a single KLA result file is generated by each metrology tool used to inspect the defect along with image files for each defect. For the scanning electron microscope process 206, the KLA result file is produced per wafer. For the wafer defect inspection process, the KLA result file is produced per lot. If the revisit process is performed on a wafer, only one wafer defect inspection process KLA file is produced showing the combined information for the on-the-fly and revisit classifications.

The wafer defect inspection process and the scanning electron microscope process 206 export their KLA result files and image files to a directory that is located locally to the process and/or 206 i.e., either in the tool's computer or in the client computer. These export directories are available to the defect source identifier as Network File System mountable file systems as described above.

The KLA file typically is configured to contain many records. One embodiment of the records used by the KLA file of the defect source identifier can be arranged as follows:

InspectionStationID ;
ResultTimestamp ;
Lot identification , (char16)
Wafer identification ; (char16)
SampleTestPlan (header record)
Wafer layout data
TiffFileName
DieOrigin (coordinates of lower left corner of Die (0,0)
ClassLookup
ClassList
DefectRecordSpec (header record)
Defect data
EndOfFile

Various embodiments of records associated with the KLA files are now described. The SampleTestPlan record is a header to indicate the start of the wafer layout coordinates for each die in the tested wafer as shown in TABLE 7.

TABLE 7
Wafer Layout Coordinates of Sample Plan
Name Format
X Position Integer
Y Position Integer

A Class Lookup header is provided to indicate the start of the class mapping data. The records following the ClassLookup header are indicated in TABLE 8 and contain the classification number and the classification name corresponding to the number.

TABLE 8
Records Following ClassLookup Header
Name Format
ClassNumber Integer
ClassName Char

The DefectRecordSpec header indicates the start of the defect data. The records following the DefectRecordSpec indicated in TABLE 9 contain all the defect data for the wafer.

TABLE 9
Records in DefectRecordSpec header
Name File Format Comment
Number of Fields Int 32 Number of fields in defect list records - varies from different inspectors
DEFECTID Int32
XREL Float
YREL Float
XINDEX Int32
YINDEX Int32
XSIZE Float
YSIZE Float
DEFECTAREA Float
CLASSNUMBER Int32 Used to access case studies in the defect knowledge library database system
IMAGECOUNT Int32 Number of images for this defect not limited
IMAGELIST Int32 Variable length list of image data associated with the defect
CLUSTERNUMBER
REVIEWSAMPLE Indicates membership in a defined plan for review
DEFECTBINNUMBER Indicates membership in a defect bin based on simple defect characteristics
FINEBIN Indicates membership in a defect bin based on automatic defect review